Ramachandra carries with him 40 years of
experience related to semiconductor industries-wafer manufacturing, Chip
fabrication, testing, packaging, failure and reliability analysis. He
was awarded UNDP fellowship through which he got hands on experiences in
USA and Europe on 3-micron CMOS technologies, Laser beam systems etc. He
played key role in establishing facilities/equipment for nano
fabrication technologies in India.
Previous organizations where he served include ISRO (Failure and
Reliability analysis of space grade devices), Siltronics India Ltd.
(Growth and characterization of silicon mono crystal by CZ and FZ
techniques); Central Electronics Engineering Institute, (3-micron CMOS
technologies, Hybrid Micro Circuits, MEMS based smart sensors), Micron
Wafer Fab, Singapore (sub- micron) device fabrication and packaging).
Tessolve Semiconductor Ltd. (VLSI Circuit Edit technologies, Failure and
Reliability analysis); Central Manufacturing Technology Institute, (Nano
manufacturing technologies, Surface engineering. MEMS).
He was instrumental to establish VLSI Circuit Edit technologies for the
first time in India and providing cost effective solutions to companies
involved in VLSI Design. He had organized various training program
related to Statistical Process Control, Industrial Safety, Semiconductor
Device fabrication, Nano structure fabrication, Material
characterization, VLSI Circuit Edit technologies and Clean Room
practices He has hands on experience in servicing, up gradation and
calibration of systems used in semiconductor These include Laser beam
systems, Plasma etching systems, thin film deposition systems, Spreading
resistance measurement systems, Furnaces, SEM, TEM, industries. FIE XRD
systems.
He holds Masters Degree in Physics and Electronics from Birla Institute
of Technology and Doctorate in Electronics from Mangalore University for
his thesis on VLSI Circuit Edit technologies. He has several research
publications in the domain of semiconductor device technologies and
authored three books.